PLATE TECHNOLOGY

The right tool matters

The precision and quality of a multi-layer circuit is, among other things, largely determined by the press tool. Therefore, selection and design of the tool is of utmost importance. It must meet the highest requirements in regards to precision of the hole distances, hole dimensions (for PinLam), parallelism, and flatness.

Carrier plates, Top plates, Bonding plates
Steel quality: DIN 42 CrMo4
AISI 4140 H
DIN 50 CrV4
AISI 6150 H
RHCS 50
DIN X20CrMo13
Hardness: 40 ± 2 HRC 40 or 50 ± 2 HRC 50 ± 2 HRC
Thermal expansion coefficient: 12 x 10-6 / °C 11 x 10-6 / °C
Heat conductivity: 42 W/mK 25 W/mK
Working temperature: ≤ 400 °C

≤ 400 °C or
≤ 250 °C

≤ 400 °C
Dimensions and tolerances Standard Premium
(for all versions)
Length / Width:
For large formats > 2000 mm:
± 0.5 mm
+ 3-5 / -0 mm
Thickness: ± 0.2 mm
Hole-to-hole tolerance for registration holes: ± 0.02 mm ± 0.012 mm
Wire cut registration slots: on request
Flatness: 0.2 - 3 mm depending on size and thickness
Parallelism:
For large formats > 2000 mm:
≤ 0.03 - 0.05 mm
≤ 0.1 mm
Surface finish: Grit 80
Ra ca 1.2 - 2.50 µm
Available thickness: 2.0 - 15.0 mm up to 10 mm

Press plates with wire-cut registration holes on request. Variations to above mentioned tolerances and standard specifications possible on request. Subject to changes due to technical improvements without prior notice.