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R. Mark Fink
C.A.PICARD Inc.
305 Hill Brady Road
Battle Creek, Michigan 49037
USA
Tel.: +1 (440) 366-5400
Fax: +1 (440) 366-5404
Email: rmfink@capicard.com
 
Dylan Rogan
C.A.PICARD Inc.
305 Hill Brady Road
Battle Creek, Michigan 49037
USA
Tel.: +1 (269) 962-2231
Fax: +1 (269) 962-4916
Email: drogan@capicard.com
 
Gary Weidner
C.A.PICARD Inc.
305 Hill Brady Road
Battle Creek, Michigan 49037
USA
Tel.: +1 (269) 962-2231
Fax: +1 (269) 962-4916
Email: gweidner@capicard.com
 
Kenny Ho
C.A.PICARD Far East Ltd.
20 Dai Fu Street
Tai Po Industrial Estate
Tai Po, N.T.
Hong Kong
China & HK
Tel.: +852 26 65 78 68
Fax: +852 26 66 63 81
Mobil: +852 91934481
Email: kenny_ho@capicard.com.hk
 
Eric Ling
C.A.PICARD Far East Ltd.
20 Dai Fu Street
Tai Po Industrial Estate
Tai Po, N.T.
Hong Kong
China & HK
Tel.: +852 26 65 78 68
Fax: +852 26 66 63 81
Mobil: +852 94728239
Email: eric_ling@capicard.com.hk
 
Charles Chou
C.A.PICARD (Suzhou) Representative Office
No. 803 & 804 JinDu Building
76# East ShiHu Road
Wuzhong District
Suzhou, Jiangsu Province P.R.C.
Postcode: 215128
China
Tel.: +86 (512) 6762-3304
Fax: +86 (512) 6598-2080
Mobil: +86 (1386) 2158-378
Email: charles_chou@capicard.com.cn
 

ORC Manufacturing Vertriebs GmbH
Kreuzstr. 34
40210 Düsseldorf
Germany
Tel.: +49-211-1378-140
Fax: +49-211-1378-149
Email: info@capicard.com

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MULTILAYER REGISTRATION SYSTEMS   -  Materials  
C.A.PICARD - Guides and Technical Papers
Guides and Technical Papers

The following guides and technical papers are available from C.A.PICARD. Please contact us if you are interested in receiving this information.


Image Process Guide:
This comprehensive guide provides detailed information on implementing a registration system based on the Post-Etch punching process. This guide provides the manufacturer specific tips and techniques for optimizing their process.


Increasing Productivity and Improving Registration in Imaging:
This technical paper provides information on the requirements for successfully using glass to glass registration tooling in imaging.


Different Tooling Approaches for Laminating Multilayer PC Boards:
This technical paper provides details on material specifications and tooling approaches for laminating multilayer printed circuit boards


  C.A.PICARD - Guides and Technical Papers