Post-etch punching avoids the tolerance errors that accumulate when punching is done prior to etching. As a result, multiple layers are registered with greater precision and the finished PCBs reflect maximum accuracy. In other words, the post-etch process dramatically improves multilayer productivity and yields.
A post-etch punch enables us to view the etched target placed on the board in relation to the image and subsequently split the difference of any error and punch the tooling hole locations.
Image registration is now greatly improved because the punch locations are placed in relation to the image.
Expansion and contraction error can now be compensated for prior to lamination. This is possible because the majority of material expansion and contraction has already occurred during the previous develop-etch-strip phase.