On 16 and 17 October 2025, we participated in the DieTechExpo 2025 in Prague.

The industry event, which so far took place as technology forum in Strasbourg or Luxembourg every two years, was held as trade fair in Prague for the first time. The new format directly attracted 303 participants and visitors from 31 countries - from the USA to China.

In the Prague Congress Centre, the leading manufacturers of the world presented their latest developments with regard to production and application of cutting dies. The exhibitors took advantage of the possibility to present their innovative products - which already today meet the requirements for challenging packaging solutions of tomorrow - to the trade visitors on the spot. 

This year, we used this excellent platform for the first time in order to present our highly precise die cutting plates for flatbed die-cutters to international trade visitors.

We had good discussions about the die cutting technology with a focus on packaging with our visitors on these two days. Our customers, who are also system and solution providers as well as  machine manufacturers, confirmed that they are very content with the products delivered by C.A.PICARD^®. And the contacts with potential customers, who were very interested in our product range, became even more substantial after the exhibition.

The DieTechExpo trade fair shall also take place every two years. The organisation of the next exhibition has already started. We are sure to participate again.