Focusing on AI and Smart Manufacturing, the International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show) was held from 3 to 5 December 2025 in halls 5-8 of the Shenzhen World Exhibition & Convention Center (Bao'an). With the theme "Better Life With AI - New Business for PCB", the trade fair brought together 651 global exhibitors, with 3,656 booths spread across an area of 80,000 m2. It featured nine thematic zones including two newly added pavilions: "Packaging & Testing Technology Pavilion" and "Precision Accessories & Components Pavilion". It presented a complete industry chain from materials, manufacturing and assembly to packaging and testing. Breakthrough solutions around high-layer-count PCBs, IC substrates, FPC, HDI, glass substrates, high-speed/high-frequency materials and full semiconductor production workflows were unveiled, offering the industry a comprehensive view of the latest technological advancements.
The exhibition attracted 77,508 professional visitors from nearly 70 countries and regions. It also hosted 38 concurrent conferences attracting 3,390 participants in total, with key events including the International Technical Conference and Smart PCB: AI Trends & Innovations Conference.
C.A.PICARD® exhibited at hall 8, booth 8E27. We had in-depth talks with customers and upstream/downstream partners, capturing valuable industry insights. Our key takeaway from the exhibition was clear: "AI Computing Power + High-end Substrates" is emerging as the PCB industry's core growth engine. AI is driving PCBs towards higher layer counts, higher frequency/speed and greater reliability. Demand is surging in four key areas.
AI Servers/Data Centers: The fastest-growing demand segment, with PCB value per AI server increasing many times more than with traditional servers.
Communication Equipment: 5G deployment has solidified the need for high-frequency, high-speed PCBs, with per-station value significantly higher than with 4G. Ongoing 6G technology development will further amplify the demand for such materials.
Consumer Electronics: High-end smartphones, AR/VR devices continue to drive the demand for advanced HDI and high-end FPCs.
Automotive Electronics: The growing intelligence of new energy vehicles is spurring the demand for high-end PCBs, such as domain controllers and BMS. Both PCB volume and value per vehicle have increased several times more than with traditional combustion vehicles.