The International Electronic Circuits (Shanghai) Exhibition 2026 took place at the National Exhibition and Convention Center (Shanghai) from 24 to 26 March 2026. As global bellwether for the PCB industry, this year's event was themed "PCB + AI: Next-Generation Packaging". The show featured 839 exhibitors across the value chain, spanned an exhibition space of 56.000 m2 and attracted 80,654 professional visitors in three days.
C.A.PICARD® participated at booth 8K35 in hall 8.1 and engaged with global industry peers to explore AI-driven opportunities in electronic circuits and strengthen partnerships across the value chain.
Key Technology Trends:
Advanced Packaging & Glass Substrates Take Center Stage
Driven by surging demand for AI computing power and high-performance computing (HPC), ultra-high-layer, ultra-large and ultra-high-speed PCBs, along with IC substrate technologies, emerged as focal points. The industrialisation progress of glass substrates drew the attention of the industry to a significant extent.
High-Speed Communication Solutions Abound
Addressing 5.5G and millimeter-wave communication requirements, innovative solutions featuring low-loss materials and mSAP (modified Semi-Additive Process) were showcased, offering viable paths to overcome signal integrity challenges in the "Internet of Everything" era.
Automotive Electronics Gains Strong Momentum
Solutions for autonomous driving domain controllers, automotive radar systems and high-reliability HDI boards attracted strong interest, highlighting the expanding application potential of electronic circuit technologies in intelligent mobility.
The exhibition reaffirmed that AI and advanced packaging technologies are fundamentally reshaping the industry landscape.